Technological processes

Using computer simulation allows reducing time required to choose operational parameters for technological processes such as material drying and the development of specialized software for such purposes.

Computer simulation helps to optimize the removal of the required amount of moisture from the material, thus reducing energy costs.

We simulate the drying process for a various number of heat sources: convective drying, radiation drying, microwave drying, and also depending on the duration of the exposure source — continuous or discrete drying.

MEMS integrate miniaturized mechanical structures with electronics to extend the benefits of planar integrated circuit technology to a broader class of systems, involving sensors, actuators, filters, resonators, switches, and wave guides. The mechanical structures, such as beams, plates, groves, and diaphragms, implement transduction between energy domains, passive implementations of discrete electrical devices, and conduction paths for electromagnetic radiation.

The computation of the material stress-strain state allows to set many of its physical properties. With the estimated stress strain state information, we can predict how a part or a structure will behave under operating loads.

The main objectives of stress-strain state computation are:

(1) Finding the initial deformation of a tensile load;

(2) Description of the physical properties of metals on the basis of their strain diagram;

(3) Determine how metal quenching affects its physical properties;

(4) Determine how phase transformations in steel affect its physical properties;

(5) Prediction of the physicochemical component properties on the basis of available experimental data.